Colin’s research and development has greatly increased the number of parts used in 3D printing in the semiconductor field within five years

Lam Research, founded in 1980 and headquartered in the United States, is one of the main suppliers of wafer manufacturing equipment and services to the world’s semiconductor industry, the world’s top three semiconductor process equipment suppliers, and the world’s largest etching process. equipment supplier.Today, with the development of additive manufacturing technology, Colin R&D has set its sights on3D printingNew semiconductor metal alloy field with plans to increase substantially within five years3D printingThe number of parts used in the semiconductor field.

Source: VELO3D

stable3D printingBringing confidence to your additive manufacturing process

Colin R&D and VELO3D have announced a joint development agreement that includes collaboration on novel materials and designs in metal additive manufacturing (AM) for the semiconductor industry. VELO3D will be based on its Sapphire®3D printingLam Capital, a related investment company of Collin R&D, will also inject an undisclosed amount of investment into VELO3D. Collin R&D is using additive manufacturing as a driver of innovation, enabling Collin R&D customers to build smaller, faster, more powerful, and more power-efficient everyday electronic devices.According to VELO3D, Colin R&D needs3D printingThe highest level of repeatability and consistency in the process enables precise control of metal crystallization. VELO3D’s quality control and traceability capabilities can accelerate Collin’s R&D innovation journey for the production of cutting-edge microprocessors, memory devices, and numerous related products in the not-too-distant future.

Sapphire® by VELO3D3D printingmachine

VELO3DMetal3D printingIt belongs to selective laser melting technology. According to the market observation of 3D Science Valley, in semiconductor manufacturing, selective laser melting of metals3D printingFunctionally integrated parts can improve the cooling capacity of semiconductor processing equipment.In this regard, according to 3D Science Valley’smarket research, Internationally, semiconductor manufacturing equipment company Varian Semiconductor Equipment Associates uses additive manufacturing technology to manufacture cooling components in ion implanters with cooling ducts integrated inside the components. In the case of additive manufacturing technology, the design space of the conduit is improved. For example, it can be designed to have a spiral-shaped structure, the cross-section of the conduit can be designed as a polygon, and multiple conduits can be integrated in the component, at least one of which can have A circular cross-section can also create a set of raised surface features on the inner surface of the catheter that can extend into the inner region of the catheter.

Compared with traditional design and manufacturing methods,3D printingCatheter Catheters can be designed with complex shapes, profiles, and cross-sections that are not achievable using conventional subtractive manufacturing techniques (eg, drilling). Cooling components can be designed to be closer to the ideal geometry, thereby improving the thermal performance of the fluid system. in addition,3D printingThe technology can effectively control the inner surface finish of the conduit and its characteristics, and play a role in affecting the flow characteristics of the fluid. By changing the inner surface characteristics of the conduit, the flow characteristics (such as turbulence) can be changed, which is impossible for traditionally designed conduits. .

Colin R & D has the potential to convert metals3D printingUsed to manufacture critical components, especially those with cooling function, to improve the performance of their semiconductor manufacturing equipment. In addition, Collin R&D has acquired Coventor, a MEMS modeling and simulation software provider. Coventor is a software company focused on designing microelectromechanical systems (MEMS) chips and sub-10 nanometer (nm) semiconductors.Colin R & D will metal3D printingCombined with Micro Electro Mechanical Systems (MEMS) chips and sub-semiconductor fields? Additive manufacturing is still an emerging technology in the semiconductor field,3D printingEquipment companies, forward design companies, and material companies are taking advantage of additive manufacturing technology in many ways to promote3D printingSolutions in the field of semiconductors, related to3D printingIn-depth application and technology development trend in the semiconductor field.

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