China3D printingNet August 7th, scholars from the United States and Ireland recently gathered at the 18th Conference of the Thermal and Thermomechanical Phenomenon of Electronic Systems in Las Vegas, Nevada, to discuss the topic of using3D printingdesignInnovative radiator.
As the demand for personal electronic products continues to grow, radiator design has become more important. This is due to its ability to adjust the temperature of electronic equipment to prevent overheating in places such as computer processors.
In the game sponsored by GE, a total of five finalists from Arizona State University (ASU), Purdue University, University of Maryland, Pennsylvania State University and Trinity College Dublin showcased their novel3D printingMetal heat sinks can effectively cool electronic products.
“Some functions cannot be achieved by traditional methods.” Faizan Ejaz, PhD in mechanical engineering at Arizona State University, said, “If you want to make a cylindrical honeycomb structure, you can’t make it without other expensive post-processing steps. With additive materials With the advent of manufacturing, we can now manufacture very complex geometries.”
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Aluminum heat sink “alt=”designed by ASU students Faizan Ejaz, Munku Kang and Gokul Chandrasekaran
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Aluminum heat sink” />
Designed by ASU students Faizan Ejaz, Munku Kang and Gokul Chandrasekaran3D printingAluminum heat sink. Photo courtesy of Beomjin Kwon / ASU.
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The metal parts produced by additive manufacturing processes such as laser powder bed fusion (LPBF) have a wider range of complex geometries, which cannot be achieved by traditional CNC.include3D printingMetal fins, engine cylinders and oil pump housings can be manufactured by LPBF at a fraction of cost and material.
Using the GE Concept Laser M2 cusing system, 5 university teams stood out from 21 teams to participate in the finals. They realized every design concept and achieved the best heat dissipation effect. The ASU team allowed a larger surface area on the radiator to allow hot air from electrical components to flow without affecting its efficiency. According to the team, this is a common design limitation in traditional manufacturing.
“In many cases, we have to compromise between manufacturing constraints and equipment performance,” explained Beomjin Kwon, an assistant professor in the School of Material, Transportation, and Energy Engineering at Arizona State University, and head of the design team.
“Therefore, in real experiments, we do not have really optimized equipment. But additive manufacturing now eliminates many design constraints imposed by traditional technologies. Compared with traditional heat transfer equipment, we can consider further optimization of the design.”
A cool concept
Elsewhere, the Purdue University team used topology optimization to find the best material distribution in a given size of the heat sink design.In addition, considering the thermal resistance, its3D printingThe final shape of the heat sink has a gently inclined “L” shape on one side and a protruding “d” shape on the other side. This causes the airflow to rise and recirculate, spending more time in the radiator.
Serdar Ozguc, a PhD student at Purdue University’s Cooling Technology Research Center (CTRC), said, “Today’s electronic components have huge thermal challenges. People want smaller computers and mobile phones, but at the same time, they need more electricity.
The heat generated by these CPUs will affect performance, so we must find a safe and effective way to dissipate heat. “
All teams participating in this competition are subject to the same size and aluminum material restrictions.In addition, all3D printingAll of the radiators have been tested under the same conditions at Oregon State University.
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